HEICO Corporation has acquired BERNIER connect S.A.S.
HEICO Corporation, through its French subsidiary 3D Plus, has acquired BERNIER connect S.A.S.
HEICO Corporation is engaged primarily in the design, production, servicing and distribution of products and services to certain niche segments of the aviation, defense, space, medical, telecommunications and electronics industries through its two segments, the Flight Support group and the Electronic Technologies group. HEICO's customers include a majority of the world's airlines and overhaul shops, as well as numerous defense and space contractors and military agencies worldwide, in addition to medical, telecommunications and electronics equipment manufacturers.
3D Plus is a world leading supplier of advanced high density 3D microelectronics products and bare die and wafer level stacking technology. The company's high-tech solutions are used in computer boards and embedded systems, defense and security, aircraft, medical and aerospace applications.
Founded in 1933, BERNIER designs, assembles and markets connectors and interconnection systems for command, control and communication devices used in radio communication and intercom equipment electronic boxes embedded in armored vehicles and aircraft, communication networks integrated into infantry men's clothing and accessories. With 28 employees, BERNIER's products combine quality, ergonomics and toughness, particularly adapted to severe environments. The company's client portfolio include tier-1 military equipment, and defense and security manufacturers in 40 countries.
Oaklins' team in France advised HEICO Corporation and its French subsidiary 3D Plus in the acquisition of BERNIER.
Talk to the deal team
Thibaut de Monclin
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